Tender For supply of front panel lcso pcb fabrication (c115. 15. 1500) specification as per the annexure-1 , interconnect lcso pcb fabrication (c115. 15. 1600) specification as per the annexure-1 , mother board lcso pcb fabrication ( c115. 15. 0500) specification as per the annexure-1
Tender For tender for supply of mother board , processor i3 12 th gen , acer monitor , waste pad , epson head , pressure roller , teflon , head timing belt , waste pad m2140